Chih Chen received his Ph.D. degrees in Materials Science of University of California at Los Angeles (UCLA) in 1999 in Prof. King-Ning Tu’s group. He served as lecturer at UCLA MSE from 1999-2000. He joined National Chiao Tung University (NCTU), Taiwan as an assistant professor in 2000. He is currently the chairman & distinguished professor of Department of Materials Science and Engineering in NCTU, Taiwan. Professor Chen discovered electrodeposition of (111)-oriented nanotwinned Cu, and reported it in Science 336, 1007-1010 (2012), and transferred the fabrication technology to Chemleaders, Inc, Taiwan for mass production in 2016. Therefore, he received the 2016 National Innovation Award, 2016 Materials Innovation Award, Materials Research Society, Taiwan, 2017 Outstanding Technology Transfer Award on Electroplating and Application of High (111)-oriented Nanotwinned Cu, 2018 Outstanding Researcher Award, Ministry of Science & Technology, Taiwan. TMS 2018 Research to Practice Award, The Minerals, Metals & Materials Society (TMS), USA. It is noteworthy to mention that TMS is the second largest materials society in the world and there are over 4000 members in TMS. There is only one recipient each year for the Research to Practice Award. His current research interests are reliabilities of flip-chip solder joints and microbumps for microelectronics packaging, including electromigration, thermomigration of solder joints. He focuses on fabrication and applications of nanotwinned Cu in recent years, such as low-temperature Cu-to-Cu direct bonding, high strength nanotwinned Cu lines and films for 3D IC integration. He published 168 journal papers and he holds 30+ Taiwan and US patents. He is currently writing a book for Wiley on Electronic Packaging Science and Technology, and the book will be in production in 2021.